POLYMERS FOR OPTICAL AND

MICROWAVE APPLICATIONS

Design, Fabrication, and Packaging Process


More courses related to optical areas are listed below.

 

 Optoelectronic Technology

Optical Networks

Fiber Optic Technology

 Fiber Optic Communications

 

Course Description

Instructor

Course Outline

Course Materials

Who Should Attend

Locations

Benefits

REGISTER

Homepage

 

 

DATES AND LOCATIONS

June 20 and 21, 2016.

June 19 and 20, 2017.

Cleveland, Ohio.

Call for seminar’s location: 216-849-2512

 

September 5 and 6, 2016.

September 4 and 5, 2017.

Cleveland, Ohio.

 

December 5 and 6, 2016.

December 4 and 5, 2017.

Cleveland, Ohio.

 

ON-SITE TRAINING: For more information, call at 216-849-2512.

Cost: $1,200.

Registration Contact: 216-849-2512

Course Description

Today, literally hundreds of polymeric materials have found widespread use in the manufacture of microwave, electronic, and photonic systems . This is due in part to their structures that can be tailored to provide a wide range of physical properties, and also due to the ease of processing and fabrication of polymers.

This course presents some important applications of polymers in electronic and photonic applications. The course begins with an overview of polymer materials which includes in detail both advantages and disadvantages of polymers and comparison of polymers with other materials. It also presents the development of intrinsically conducting polymers that exhibit conductivities similar to metal. Following this, it explores the lithography processing techniques associated with the use of polymer materials such as processing conditions, photolithography methods, and patterning methods. Described in detail are the characteristics of polymer resists and issues of packaging and chip materials to illustrate the importance of polymer materials and processing in attaining VLSI devices in electronic applications. In addition, it addresses significant issues regarding nonlinear optical polymers and microwave loss in polymers, followed by a discussion of processing and fabrication techniques for integrated optical waveguides, an emerging technology for polymers in photonic applications. And finally, the course outlines recent advances in developments and applications of polymer based materials. BACK

Instructor

Hung D. Nguyen, Ph.D.

Dr. Nguyen is a senior engineer for the Space Communication Division of NASA Glenn Research Center at Cleveland, Ohio, where he is engaged in the development and commercialization of semiconductor integrated optoelectronics devices for high speed communication systems and fiber optic networks. He has been in the field of fiber optic networks and telecommunications for over 15 years. His areas of specialization include integrated optic devices,optic networks and telecommunications, data communications, optical and electronic packaging, and micro-lithography. He is a lead engineer and project manager in photonics and microlithography systems programs, and has been directly involved in all phases of development and implementation of integrated fiber optic systems. In addition, he has lectured and written numerous technical papers on optical networks and telecommunications systems. Dr. Nguyen earned his Ph.D. in electrical engineering and applied physics from Case Western Reserve University. BACK

Who Should Attend

Practicing scientists, engineers, managers, marketing/sale personnel, or technicians who desire either an introduction or overview/review of organic polymers for applications in RF microwave , electronics, and photonic systems. BACK

Benefits

  • Understand the practical and technical issues of organic polymers used in microelectronic and photonic device fabrication.
  • Learn the recent developments and applications of polymer based devices.
  • Understand the important aspects of mechanical, adhesive, and diffusive properties of polymers in electronic applications.
  • Gain knowledge of the latest development in polymers for non-linear optics and integrated optical waveguides in photonic applications.
  • Develop a basis for further research and development.

Course Outline

Overview of Polymer Materials

 

Types of polymer materials

Chemistry of Polymers

-Sythesis

-Polymerization

-Conductive

-Dielectric properties

Uses of polymer materials in industry

-Radiation-sensitive materials

-Dielectric materials

-Encapsulation materials

-Conducting materials

-Nonlinear optical materials

Advantages and disadvantage of polymer materials

Comparison of material systems

Processing of organic materials

Lithography Processing Techniques for Polymer Materials

Processing conditions

-Wafer preparation

Deposition and coating of polymer film

-Adhesion promoters

-Spin coating

-Spray coating

-Photolithography

-Proximity printing

-Contact printing

-Soft bake

Photolithography methods

-Electron-beam lithography

*Positive resist

*Negative resist

*X-ray lithography

Patterning methods

-Process of developments

-Isotropic etching

-Anisotropic etching

-Dry etching process

-Wet etching process

-Reactive ion etching process

*Non-erodible etch mask

*Erodible etch mask

-Lift-off process

-Photosensitive process

 

Issues of packaging and chip materials

 

Resist requirements

-Contrast, Sensitivity, Resolution, Etching resistance

Chemistry and processes associated with resists

-Positive resists

-Negative resists

-Multilevel resists

-UV resist

-E-beam resist

-X-ray resist   

Polymers and other materials dielectrics

-Thermal properties

-Electric properties

*Frequency range, dielectric constant, dissipative factor, resistivity,

*voltage breakdown, loss, and power factor

-Mechanical properties

*Stress, adhesion strength

-Dielectric properties and high speed application

-Yields and reliability issues

Materials/Process choice

Adhesion of metal/polymer structures

-Polymer to substrates

-Polymer on metals

-Metal on polymers

*Cr/polymer interface

*Cu/polymer interface

*Cu/Cr/polymer interface

-Polymer on polymers

Metal diffusion in polymers

-Cu/Polymer, Ti/Polymer

-Cr/Polymer, Ni/Polymer

Corrosion of multilayer metal structures

-Cr/cu interfaces

-Cr/Ni/Cu interfaces

Thermal stability of multilayer structures

Temperature requirements for integrated optic modules

Type of conductive polymers

Conductivities of various compounds

DC conductivity measurement

AC conductivity measurement

Protection layers

Intermetal dielectric layers

Nonphotosensitive polymer

Photosensitivity polymer

 

Nonlinear optic polymers

 

Type of guest-host polymers

Nonlinear optical properties

-Second-order harmonics

-Third-order harmonics

Electro-optic effects

Optical Kerr effect

Polarization effects

Molecular alignment

Poling of waveguides

-Corona discharge poling

-Contact poling

*Poling stability

*Electro-optic coefficient

*Thermal stability

*Optical stability

Microwave loss in polymers

 

Integrated optical waveguides

 

Polymer waveguide

-Injection molding process

-Wet chemical process

-Projection printing process

-Ultraviolet laser process

-Photobleaching process

-Reactive ion process

Loss mechanisms

 

Developments and Applications of Polymer Based Devices

 

Optical and electronic multi-chip structures

Optical interconnects

Mach-Zehnder interferometer modulators

Traveling wave electro-optic phase modulators

Directional mode couplers

Optical switchings

Mutiplexers and demultiplexer

Multilevel active structures

Y-junction hybrid couplers

Elevated waveguide for multilayer circuits

Mutimode star couplers

*Mix rod structure

*Symmetric tree structure

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INFORMATION ON REGISTRATION.

 

TIME : 8: 00 – 5:00

FEES : $1,200.

3-way of Payment:

 

1.Check payable to : Lightwave Technology Corp. (Mail to: Lightwave Technology Corp.,

1564 Belle Ave, Lakewood, Ohio 44107.

2. Purchase order attached : #                                

3. Invoice my company: Attention :

Seminar Location:

To be announced.

 

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IN-HOUSE SEMINAR INFORMATION.

Date: 2 days

Time: 8:00 - 5:00

Maximum students per training section: 20

Fees: $ 7,800. ( Fee includes travel expense and class materials)

 POLICY

 DEAD LINE REGISTRATION

Registration by regular or electronic mail must be received at least 14 days before the first day of class (course date)

REFUND POLICY

Full refund if class is cancelled. Otherwise, 20% refund less than 7 days before the first day of class. No refund is granted the first day of class.

 

Lightwave Technology Corp. reserves the right to cancel class if there is inadequate enrollment.